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The CT1000 can automatically transport wafers of up to 8 inches (200 mm) in diameter and accurately move to the pattern location to be observed for defects. The sample stage can be tilted to perform 3D SEM observation. If a defect is found, it can perform elemental analysis of the relevant defect. Elemental analysis can be used to analyze factors causing yield decrease and can help to improve the quality of semiconductor devices in development and manufacturing processes. After reviewing defects and pattern shapes, the wafer can be returned to the manufacturing line, improving manufacturing process efficiency.
A unique feature of the CT1000 is the ability to observe 3D SEM images using the sample stage tilt function. To achieve this capability, Hitachi High-Tech has developed a conical objective lens that allows wafers to be tilted up to 55°. The five-axis sample stage was developed to prevent significant movement of the center of a wafer when observed from directly above, even if the sample stage is tilted to the maximum inclination angle. This makes it possible to better capture target defects and increase work efficiency.