High Resolution Sputter Coater

The main features are:

  • Wide Choice of Coating Materials:-
    Magnetron head design and effective gas handling allow a wide choice of target materials (see specification).
  • Precision Thickness Control:-
    Thickness optimized to the FE-SEM operating voltage using the MTM-20 high resolution thickness controller.
  • Multiple Sample Stage Movements:-
    Separate rotary, planetary and tilting movements allow optimized coating distribution and coverage. (view RPT Stage)
  • Variable Chamber Geometry:-
    Chamber geometry is used to adjust deposition rates from 1.0 nm/sec to 0.002nm/sec to optimize structure.
  • Wide Range of Operating Pressures:-
    Independent power/pressure adjustment allows operation at argon gas pressure ranges of 0.2 - 0.005 mbar.
  • Compact Modern Benchtop Design:-
    Space and energy saving design eliminates need for floor space, water, specialized electrical connections.
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