High Resolution Sputter Coater
The main features are:
Wide Choice of Coating Materials:-
Magnetron head design and effective gas handling allow a wide choice of target materials (see specification).
- Precision Thickness Control:-
Thickness optimized to the FE-SEM operating voltage using the MTM-20 high resolution thickness controller.
- Multiple Sample Stage Movements:-
Separate rotary, planetary and tilting movements allow optimized coating distribution and coverage. (view RPT Stage)
- Variable Chamber Geometry:-
Chamber geometry is used to adjust deposition rates from 1.0 nm/sec to 0.002nm/sec to optimize structure.
- Wide Range of Operating Pressures:-
Independent power/pressure adjustment allows operation at argon gas pressure ranges of 0.2 - 0.005 mbar.
- Compact Modern Benchtop Design:-
Space and energy saving design eliminates need for floor space, water, specialized electrical connections.
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